One large heat sink for ARM processor, two small heatsinks one for LAN controller and the other for 3.3V regulator
3M adhesive thermal tape for efficient thermal transfer to the heat sink, providing additional cooling to the IC
Can be used with other devices such as the Beaglebone to cool the processor, regulators, etc.
Also works on the SMCI USB/NIC controller chip, although it is somewhat larger than the chip itself
Package weight: 0.027 kg
Product Size(L x W x H): 1.40 x 1.40 x 0.60 cm / 0.55 x 0.55 x 0.24 inches
Package Size(L x W x H): 5.00 x 3.00 x 1.00 cm / 1.97 x 1.18 x 0.39 inches
Product Size(L x W x H): 1.40 x 1.40 x 0.60 cm / 0.55 x 0.55 x 0.24 inches
Package Size(L x W x H): 5.00 x 3.00 x 1.00 cm / 1.97 x 1.18 x 0.39 inches
Package Contents: 1 x Chip Heat Dissipation Panel ( 14 x 14 x 6 mm ), 2 x Chip Heat Dissipation Panel ( 8 x 8 x 5 mm )
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